10th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2017)

by Andrei Chis, Feb. 13, 2017

Software Language Engineering (SLE) is the application of systematic, disciplined, and measurable approaches to the development, use, deployment, and maintenance of software languages. The term "software language" is used broadly, and includes: general-purpose programming languages; domain-specific languages (e.g. BPMN, Simulink, Modelica); modeling and metamodeling languages (e.g. SysML and UML); data models and ontologies (e.g. XML-based and OWL-based languages and vocabularies).

**Call for Papers**


10th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2017)

23-24 October 2017, Vancouver, Canada

(Co-located with SPLASH 2017)

General chair:

   Benoit Combemale, University of Rennes 1, France

Program co-chairs:

   Marjan Mernik, University of Maribor, Slovenia

   Bernhard Rumpe, RWTH Aachen University, Germany

Artifact evaluation chairs

   Tanja Mayerhofer, TU Wien, Austria

   Laurence Tratt, King's College London, UK



Follow us on twitter: https://twitter.com/sleconf


### Important Dates

Fri 2 Jun 2017 - Abstract Submission

Fri 9 Jun 2017 - Paper Submission

Fri 4 Aug 2017 - Author Notification

Thu 10 Aug 2017 - Artifact Submission

Fri 1 Sep 2017 - Artifact Notification

Fri 8 Sep 2017 - Camera Ready Deadline

Sun 22 Oct - SLE workshops

Mon 23 Oct - Tue 24 Oct 2017 - SLE Conference

### Topics of Interest

SLE aims to be broad-minded and inclusive about relevance and scope. We solicit high-quality contributions in areas ranging from theoretical and conceptual contributions to tools, techniques, and frameworks in the domain of language engineering. Topics relevant to SLE cover generic aspects of software languages development rather than aspects of engineering a specific language. In particular, SLE is interested in principled engineering approaches and techniques in the following areas:

* Language Design and Implementation

   * Approaches and methodologies for language design 

   * Static semantics (e.g., design rules, well-formedness constraints)

   * Techniques for behavioral / executable semantics

   * Generative approaches (incl. code synthesis, compilation)

   * Meta-languages, meta-tools, language workbenches

* Language Validation

   * Verification and formal methods for languages

   * Testing techniques for languages

   * Simulation techniques for languages

* Language Integration and Composition

   * Coordination of heterogeneous languages and tools

   * Mappings between languages (incl. transformation languages)

   * Traceability between languages

   * Deployment of languages to different platforms

* Language Maintenance

   * Software language reuse

   * Language evolution 

   * Language families and variability 

* Domain-specific approaches for any aspects of SLE (design, implementation, validation, maintenance)

* Empirical evaluation and experience reports of language engineering tools

   * User studies evaluating usability 

   * Performance benchmarks

   * Industrial applications

### Types of Submissions

* **Research papers**: These should report a substantial research contribution to SLE or successful application of SLE techniques or both. Full paper submissions must not exceed 12 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/).

* **Tool papers**: Because of SLE's interest in tools, we seek papers that present software tools related to the field of SLE. Selection criteria include originality of the tool, its innovative aspects, and relevance to SLE. Any of the SLE topics of interest are appropriate areas for tool demonstrations. Submissions must provide a tool description of 4 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/), and a demonstration outline including screenshots of up to 6 pages. Tool demonstrations must have the keywords “Tool Demo” or “Tool Demonstration” in the title. The 4-page tool description will, if the demonstration is accepted, be published in the proceedings. The 6-page demonstration outline will be used by the program committee only for evaluating the submission.

* **Industrial papers**: These should describe real-world application scenarios of SLE in industry, explained in their context with an analysis of the challenges that were overcome and the lessons which the audience can learn from this experience. Industry paper submissions must not exceed 6 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/).

* **New ideas / vision papers**: New ideas papers should describe new, non-conventional SLE research approaches that depart from standard practice. They are intended to describe well-defined research ideas that are at an early stage of investigation. Vision papers are intended to present new unifying theories about existing SLE research that can lead to the development of new technologies or approaches. New ideas / vision papers must not exceed 4 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/).

### Artifact evaluation

Authors of accepted papers at SLE 2017 are encouraged to submit their experiment results used for underpinning research statements to an artifact evaluation process. This submission is voluntary and will not influence the final decision regarding the papers. 

Papers that go through the Artifact Evaluation process successfully receive a seal of approval printed on the first page of the paper in the proceedings. Authors of papers with accepted artifacts are encouraged to make these materials publicly available upon publication of the proceedings, by including them as "source materials" in the ACM Digital Library.

### Publications

All submitted papers will be reviewed by at least three members of the program committee. All accepted papers, including tool papers, industrial papers and new ideas / vision papers will be published in ACM Digital Library.  

Selected accepted papers will be invited to a special issue of the Computer Languages, Systems and Structures (COMLAN) journal.

### Awards

* **Distinguished paper**: Award for most notable paper, as determined by the PC chairs based on the recommendations of the program committee.

* **Distinguished reviewer**: Award for distinguished reviewer, as determined by the PC chairs using feedback from the authors.

* **Distinguished artifact**: Award for the artifact most significantly exceeding expectations, as determined by the AEC chairs based on the recommendations of the artifact evaluation committee.

### Program Committee

Marjan Mernik (co-chair), University of Maribor, Slovenia

Bernhard Rumpe (co-chair), RWTH Aachen University, Germany

Christian Berger, Chalmers, Sweden

Mark van den Brand, TU Eindhoven, The Netherlands

Ruth Breu, University of Innsbruck, Austria

Jordi Cabot, ICREA, Spain

Walter Cazzola, University of Milan, Italy

Marsha Chechik, University of Toronto, Canada

Tony Clark, Middlesex University, UK

Tom Dinkelaker, Ericsson, Germany

Bernd Fischer, Stellenbosch University, South Africa

Sebastian Gerard, CEA, France

Jeff Gray, University of Alabama, USA

Esther Guerra, Autonomous University of Madrid, Spain

Michael Homer, Victoria University of Wellington, New Zealand

Ralf Lämmel, University of Koblenz-Landau, Germany

Tihamer Levendovszky, Microsoft, USA

Gunter Mussbacher, McGill University, Canada

Terence Parr, University of San Francisco, USA

Jaroslav Porubän, University of Košice, Slovakia

Jan Ringert, Tel Aviv University, Israel

Julia Rubin, University of British Columbia, Canada

Tony Sloane, Macquarie University, Australia

Eugene Syriani, University of Montreal, Canada

Emma Söderberg, Google, Denmark

Eric Van Wyk, University of Minnesota, USA

Jurgen Vinju, CWI, Netherlands

Eric Walkingshaw, Oregon State University, USA

Andreas Wortmann, RWTH Aachen University, Germany

Tian Zhang, Nanjing University, China

### Contact

For any question, please contact the organizers via email: sle2017@inria.fr